In the investor conference on 20th, Intel revealed that it will provide 3D NAND-based SSD products in the second half of next year, technology is from the company and Micron (Micron) in flash memory joint venture. It is reported that 32 layers can be stacked on a single MLC core “flat” (2D), a total of 256Gb (32GB) capacity. If using 3-bit (TLC) program, then the capacity of each unit can be further upgraded to 384Gb (48GB).
the nonvolatile Intel senior vice president and general manager Rob Crooke said: 3D NAND expected birth 10TB SSD-level products in the next few years, even the package thickness of only 2mm of 1TB storage (ideal for mobile devices) .
Crooke noted that the most significant feature of 3D technology is a major breakthrough in terms of cost, but Intel may not personally manufacture 3D NAND– even if the company has the ability, but only in the sense that the time will own production